The “Tech Innovation Excellence Award (
#TIEAward)” is a contest co-organized by Taiwan’s National Science and Technology Council (NSTC) and other Taiwanese governments.
In 2023, the TIE Award will expand application eligibility under two themes, “Smart Innovation for Semiconductor” and “Technologies for Net-Zero Emissions.”
Winners of the TIE Award will receive opportunities to partner with Taiwan’s top semiconductor companies
The prizes for the winning teams on each topic:
-1st Place: USD 30,000
-2nd Place: USD 20,000
-3rd Place: USD 10,000
-3 Honorable mentions: USD 7,000 each
Winning teams from overseas will receive partial subsidies for flight tickets and accommodation.
Coworking space in Taiwan Tech Arena - TTA 臺灣科技新創基地 (
#TTA)
Submission Deadline: May 31, 2023